Topic

Semiconductor metrology

Wafer, mask and package metrology and inspection for chipmaking, from overlay and film thickness to X-ray and e-beam inspection, and the deals reshaping the equipment suppliers.

35 stories32 companiesLatest 9 November 2026

Micro-Epsilon sensor measures 300 mm wafer warpage in one capture

Micro-Epsilon sensor measures 300 mm wafer warpage in one capture

The reflectCONTROL RCS3500-300 uses deflectometry to check bow and planarity on wafers up to 300 mm, with capture times from 1 s and no stitching.

9 November 2026

Fraunhofer IPM's HoloTop Motion measures moving wafers in 3D at up to 1m/s

Fraunhofer IPM's HoloTop Motion measures moving wafers in 3D at up to 1m/s

Mitutoyo opens 300-square-meter semiconductor center in Dresden

Mitutoyo opens 300-square-meter semiconductor center in Dresden

Advanced Energy's Centra Smart Hub claims 40 percent better wafer temperature accuracy

Advanced Energy

Advanced Energy's Centra Smart Hub claims 40 percent better wafer temperature accuracy

Nikon's DSP-110 lithography system patterns 72 panels per hour at 1.5 µm

Nikon's DSP-110 lithography system patterns 72 panels per hour at 1.5 µm

All Semiconductor stories 30 more

October 2026

13 OctAtomic Machines raises $250 million for a code-driven micro-machine fabAtomic Machines
12 OctSpotfire 15.1 adds a natural-language assistant and wafer root-cause tools for engineersSpotfire
12 OctLapmaster Wolters takes minority investment from Cynosure and FernwehLapmaster Wolters and Precision Surfacing Solutions
6 OctHitachi High-Tech and ZEISS SMT expand 91-beam wafer inspection developmentHitachi High-Tech
2 OctTeledyne DALSA adds 32K resolution to Linea ML line scan camera familyTeledyne DALSA

September 2026

30 SeptCognex In-Sight 1750 targets wafer traceability in chip fabsCognex Corporation
25 SeptFraunhofer IAF's 4–420GHz amplifier chip heads to European Microwave WeekFraunhofer IAF
21 SeptTeledyne to demo 100 Gbit/s semiconductor inspection imaging platformTeledyne Vision Solutions
14 SeptSingular Photonics launches Litavis, a SPAD sensor that unifies imaging and timing on-chipSingular Photonics
9 SeptASML and TSMC aim to replace 6-inch EUV masks with 12-inch photomasks by 2031ASML and TSMC
8 SeptRigaku's CT Lab HR160 X-ray CT system resolves 250 nm features in batteries and chipsRigaku Corporation
4 SeptQuantumDiamonds shows contact-free current imaging to enable inline chip inspectionQuantumDiamonds
3 SeptPI's P-733 piezo stage hits 0.1 nm resolution for AFM and wafer metrologyPhysik Instrumente (PI)
1 SeptIndustrial Physics buys Vitrek, adding electrical safety and semiconductor metrologyIndustrial Physics

August 2026

27 AugPI's A-725 air bearing stage puts five axes of motion in one reference planePI (Physik Instrumente)
20 AugSilvaco and Dassault Systèmes link plasma, process and structural simulationSilvaco
11 AugAT Sensors' XCS 3070 WARP sensor scans profiles at up to 140 kHzAT Sensors
3 AugMultibeam signs $140 million CHIPS deal to advance electron-beam chip packagingMultibeam Corporation
3 AugAdvanced packaging pushes warpage metrology beyond a single flatness numberWooptix

July 2026

31 JulNikon's Litho Booster 1000 alignment station boosts accuracy 35 percent for 3D chip bondingNikon Corporation
27 JulMicrochip Technology to acquire edge AI chipmaker HailoMicrochip Technology
27 JulSilvaco simulates photonic chip on NVIDIA GPUs in under four hoursSilvaco Group, Inc.
13 JulQuantumDiamonds closes €91 million round to scale diamond-based chip inspectionQuantumDiamonds

June 2026

9 JunNikon developing 1.5 µm lithography system with 30 percent throughput gain over DSP-100Nikon Corporation
4 JunEmerson embeds SiMa.ai chip in industrial PCs for edge AI quality inspectionEmerson
3 JunInvisix raises €20M seed round to scale soft x-ray chip metrologyInvisix

May 2026

20 MaySony and TSMC plan joint venture for next-generation image sensorsSony Semiconductor Solutions
19 MayUviquity claims first chip-scale 229 nm laser, OEM sampling opens in Q4Uviquity
18 MayZEISS Blockwise launches with MVTec HALCON at its image-processing coreZEISS
13 MayNikon's new NEXIV VMF-K6561 measures full 600mm panel-level packages in a single setupNikon Corporation