Teledyne DALSA has released the Linea ML 32K, a line scan camera for semiconductor wafer and electronics inspection that pairs 2.5 µm pixels with a maximum line rate of 150 kHz. The company calls the resulting image quality "exceptional."
The 32K model extends the Linea ML family, which was previously offered in 8K and 16K resolutions. All three share a multiline CMOS sensor with optimized quantum efficiency. That architecture can be configured for single-line, dual-line, trilinear color, or quadlinear multispectral imaging, depending on the application.
For inspection engineers, the pixel size is the detail to watch. Teledyne says the 2.5 µm pitch makes the camera well suited to imaging an entire 300 mm wafer with a single camera.
Small-defect detection is the other pitch. According to Teledyne, HDR and sequential exposure "significantly improve" the detectability of small defects. The company describes sequential exposure as one of the family's unique features.
On the interface side, the camera uses Camera Link HS CX4 connectors for Active Optical Cables. Teledyne says the optical cabling provides complete EMI immunity.
Teledyne will show the Linea ML 32K live at VISION in Stuttgart, Germany, Oct. 6–8, 2026, in Hall 8, Booth 8B10.
