Teledyne Adimec and Teledyne DALSA, both part of Teledyne Vision Solutions, will demonstrate a new imaging platform capable of 100 Gbit/s data throughput at VISION Stuttgart, running October 6–8, 2026, in Stuttgart, Germany. Built around Sony's IMX927 image sensor, the platform is aimed at the inspection and metrology demands of advanced semiconductor packaging. Visitors can see it running at the Teledyne Vision Solutions booth, Hall 8, Booth 8B10.
The platform pairs Teledyne Adimec's S-105A110 camera with Teledyne DALSA's upcoming Xtium3-QSFP28 frame grabber. The S-105A110 delivers 105 megapixels at 110 frames per second over a CoaXPress over fiber interface, backed by factory-calibrated image correction and thermal management that Teledyne Adimec says keeps data rates and image quality stable during sustained operation. The Xtium3-QSFP28 adds dual QSFP28 connectivity, a PCIe Gen 4 host interface, and data-forwarding capability, letting the frame grabber distribute image data across scalable processing architectures instead of funneling it through a single host connection.
For engineers inspecting advanced packaging, the pairing targets a real bottleneck. As chip packages grow larger and more complex, inspection systems need wider fields of view and higher resolution without losing throughput, a combination that pushes camera interfaces and host-side data handling past what earlier CoaXPress generations could sustain.
Prototype units of the platform are expected to be available for evaluation in the first quarter of 2027. Teledyne Adimec credited the European ENTERTAIN project with contributing to the development of the 100 Gbit/s imaging platforms.
