Nikon will release the DSP-110 digital lithography system for semiconductor advanced packaging in April 2027. The maskless tool resolves 1.5 µm line and space (L/S) and processes 72 panels per hour, which Nikon says is about 40 percent faster than the DSP-100.
The throughput figure is based on 510 × 515 mm substrates, and Nikon says the DSP-110 supports large substrates. The DSP-100, announced in July 2025, resolves 1.0 µm L/S. Nikon says it reached the higher throughput by redesigning the DSP-100's optical system for 1.5 µm L/S, work it credits to its in-house optical design and manufacturing. In other words, the DSP-110 gives up 0.5 µm of resolution in exchange for more panels per hour.
Overlay accuracy holds at ≦±0.3 µm. The focus margin, which is the range over which the focal point can shift while circuit dimensions stay accurate, is wider than on the DSP-100. Nikon says that allows stable patterning across varied substrate conditions and supports yield and mass-production stability. For process engineers running redistribution layer (RDL) steps, the focus margin is the spec most likely to show up in yield.
Nikon aims the system at RDL patterning for high-density wiring on large interposers and multilayer FC-BGA substrates. The company says demand for that wiring is raising the importance of RDL patterning in advanced packaging. Because the tool needs no photomasks, it also removes mask handling from the process.
Nikon also says RDL lithography will need higher resolution as packaging technology advances. Customers can swap the DSP-110's optical system to reach 1.0 µm L/S.
