Micro-Epsilon has introduced the reflectCONTROL RCS3500-300, a 3D sensor that measures warpage and planarity across an entire wafer up to 300 mm in diameter in a single capture. The sensor works by deflectometry and, according to the company, produces no stitching errors because it never joins partial measurements.
The sensor records the full wafer surface at once and evaluates it for warpage, bow and local deformations. The result is one consistent 3D data set, with no mechanical scanning involved. Micro-Epsilon says deflectometry suits highly reflective wafer surfaces and delivers stable results on mirror-like finishes. Capture time starts at 1 s, which shortens the time a wafer sits still during inspection in automated lines.
For quality engineers checking wafers inline, a single-capture method takes the stitching step, and its error contribution, out of the measurement chain.
The sensor also supports sorting at the line. Calculated values, features and pass/fail ratings are available shortly after capture. If a defined limit is exceeded, the controller can react through the IO signals and eject a deformed wafer before it reaches the next process step.
Measurement data can be evaluated in Micro-Epsilon's 3DInspect software or passed on for processing elsewhere. Paired with the company's Industrial Performance Unit, the sensor connects to industrial controllers over PROFINET, EtherCAT and EtherNet/IP. A software development kit built on the GigE Vision and GenICam standards lets users analyze the point clouds in their own software environments.
Micro-Epsilon is showing the RCS3500-300 for the first time at SEMICON Europa in Munich, at booth 631 in Hall C1.
