Tomocube launched the HT-T1 Desktop (HT-T1D) on July 13, a desktop holotomography system for non-destructive 3D defect analysis of glass substrates used in advanced semiconductor packaging. The system applies visible-light holotomography to reconstruct the internal refractive-index distribution of glass at a sensitivity of 10⁻⁴, resolving the location, morphology, and depth profile of internal defects that surface inspection cannot reveal. Tomocube also introduced TomoAnalysis MI (TAMI), a 3D analysis software platform that quantitatively processes the refractive-index volume data and outputs structured engineering reports.
HT-T1D is positioned as an offline companion to automated optical inspection (AOI) systems. When an AOI tool flags a panel coordinate, operators transfer those coordinates to HT-T1D, which reconstructs the substrate interior in three dimensions. Because the measurement is non-destructive, the same location can be remeasured across successive fabrication stages, letting engineers track when a defect forms, propagates, or enlarges. Tomocube says the system can compress defect-analysis cycles that have traditionally required destructive cross-sectioning from days or weeks to minutes in applicable workflows.
Engineers analyzing glass core substrates and glass interposers for AI accelerator and high-bandwidth memory packaging have had few options for non-destructive depth-resolved defect characterization. The interesting part is that HT-T1D can follow the same sample through process steps such as laser drilling, etching, metallization, and singulation, generating a timeline of defect evolution without consuming the panel. Conventional destructive failure analysis cannot.
TAMI also processes data from HT-T1M, a planned in-line inspection module Tomocube intends to deploy through system integration partners, using the same data format as the desktop system. That shared format creates a continuous path from R&D investigation to production-line review. YongKeun Park, Chief Executive Officer of Tomocube, said the platform "can also address glass photonic integrated substrates for co-packaged optics, where the refractive index itself directly affects device performance," extending the system's scope from structural defect detection to functional metrology.
