Bold Laser Automation has introduced the LPC1010CO2 Laser Precision Cutting and Drilling Platform, a CO2 laser system for drilling, skiving, cutting, trimming, and selective material removal on printed circuit boards, flex circuits, and other electronic materials. The company says its trepanning optics can produce feature sizes below 22 microns.
The LPC1010CO2 is built on the company's PCP1100 Laser Printed Circuit Processor architecture. A high-peak power CO2 laser feeds a high-resolution focusing system, and the X-Y-Z motion stages offer one-micron positioning resolution. Bold Laser Automation lists dielectrics, polyimide, FR4, ceramics, and ferrite among the supported materials. Applications include drilling, milling, trimming, singulation, and skiving.
For manufacturing engineers, the practical change is in how much the operator has to touch. Todd E. Lizotte, CEO and co-founder of Bold Laser Automation, said that "by combining inline vision and automated alignment, we're helping customers hold tight tolerances while reducing the amount of operator intervention required." The system also accepts DXF and Excellon drill files, so existing CAD/CAM output can go to the machine directly.
Lizotte also pointed to the parts of the process that sit outside the laser. "Proper cooling and effective debris removal play a major role in maintaining performance, reducing downtime, and helping customers get consistent results day after day," he said. The company describes the motion control software and drilling algorithms as aimed at consistent execution across complex part geometries.
The platform ships in a fully enclosed Class 1 laser safety enclosure. Its industrial-grade door mechanisms are rated for more than 100,000 operating cycles.
